3-Dimensional Computer Processor

Scientist at University of Rochesterb has developed a new production of Computer Processors. These processors are based on 3-Dimensional Circuits in opposing to 2-Dimensional Circuits of nowadays.

This can be said as the next main progress in computer processors technology. The latest 3-D processor is organization at 1.4 GHz in the labs of University.

PRECEDENT ATTEMPTS VS LATEST INVESTIGATE

In the history attempts of making 3-D chips, scientist was just making a stack of standard processors. But at University of Rochesterb it was designed and built specially to optimize all input processing functions upright, through manifold layers of processors, the same way ordinary chips optimize functions straight.

This design means that each chore such as Synchronicity, Influence Distribution, and Extended Distance Signaling are every fully functioning in 3 dimensions for the 1st time.

EBY FRIEDMAN: THE GENTLEMAN FOLLOWING 3-D CHIPS

Eby Friedman and his students has designed this 3-D Chip, which uses various of the tricks of usual processors, but also accounts for dissimilar impedances that might happen from chip to chip, diverse operating speeds, and unusual power requirements. According to Eby Friedman, Professor of Electrical and Computer Engineering at Rochester and faculty director of the pro of the processor articulate – “I call it a dice nowadays, because it’s not just a chip any longer. This is the way computing is going to have to be done in the prospect. When the chips are flush touching each other, they can do things you could not at all do with a regular 2D chip”

TODAYS INTEGRATED CHIPS AND TROUBLES

The trouble with today’s technology of integrated circuits is that, further than a limit it is unfeasible to pack more chips next to each other which restrictions the capabilities of future processors. So number of integrated circuit designers anticipates sooner or later expanding into the 3rd dimension, stacking transistors on top of each other.

SIGNIFICANCE

Vertical Expansion of chips has lots of technical difficulties and the simply explanation to this is to design a 3-D chip where all the layers interrelate like a solitary system. Getting all 3 levels of the 3-D chip to act in agreement is like trying to plan a traffic control system for the entire United States-and then layering 2 more United States above the 1st and somehow getting every bit of traffic from any point on any level to its purpose on any other level-while concurrently coordinating the traffic of millions of other drivers.

Now if we reinstate the 2 United States layers to something more complicated like China and India where the pouring laws and roads are fairly diverse and the complexity and confront of designing a single control system to work in any chip begins to befall obvious. The 3-D Chip is fundamentally an whole circuit board folded up into a tiny package. With this technology the chips inside something like an iPod could be compressed to a 10th their current size with ten times the velocity.

Advertisements

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s